Using “negative
space” in the tool, this mold-&-fold cluster attachment bracket provides a
mounting surface for the instrument panel’s cluster without the necessity of
adding an additional part. Cluster attachment locations are integrated into the
IP substrate tool and the "molded-in hinge" is then folded into
place. This allowed the styling team to maximize the size of register openings
and the cluster lens by minimizing the design space between them.
OEM/Vehicle
2009MY Ford Motor Co.: Ford®
F-Series® Pickup Trucks
System Supplier
Automotive Components Holdings
Material Processor
Automotive Components Holdings
|
Material Supplier
Advanced Composites
Resin
ADX-5017 A10 20% Talc-Filled PP
Tooling/Equipment Supplier
Hi-Tech Mold & Eng.
|
For More Information See: http://www.plastics-car.com/InteriorComponents
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